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Allu Arjun Met 5 Directors; Circumspect Over His Next Film_我的网站

一 |     8月24日消息，据Wccftech报道，SK海力士近日详细阐述了其HBM技术路线图的加速路径，核心举措包括引入EMIB封装方案，并明确将3D集成作为长期目标。

二 |     Post the global success of Pushpa, Allu Arjun has been treading a cautious path! The icon star, as he’s fondly called by his fans, has been circumspect about his subsequent moves. After a lot of dilly-dallying, Allu Arjun zeroed in on Atlee’s sci-fi thriller which the actor has been shooting for in Mumbai. While the shooting is mid-way, reports about his next film have been doing the rounds.          Allu Arjun yet to finalize     Allu Arjun intends to complete his film with Atlee by 2026 summer, and take his next film on floors by end of that year. As part of the reports have emerged that he had zeroed in on director Lokesh Kanagaraj. But the truth of the matter is that he has been in discussion with as many as five top directors – Sanjay Leela Bhansali to Prashanth Neel to Nelson Dilipkumar, Basil Joseph and Lokesh Kanagaraj – all of them have met and narrated storylines to Allu Arjun. According to sources close to the actor, he had not finalized any director yet. “Allu Arjun wanted to do stories that have universal appeal; his idea is to expand fanbase in various countries by approving scripts that attract the hinterland. Although he is excited with story ideas of a couple of directors, he wanted to give himself some time to finalize. He hasn’t signed any film yet, but intends to take it up close to wrapping up the shooting for Atlee’s large-scale, pan-Indian science-fiction action-fantasy film – that way he gets a perfect picture on his mounting appeal.”          Global collaborations     Allu Arjun has been very ambitious about collaborating with global technicians for his films. Teaming up with Studios in the West for VFX and roping in choreographers and artists from the South-East for Atlee’s film indicates his aspirations for wider appeal.     Also Read: Allu Arjun or Pawan Kalyan? Logesh Kanagaraj Keeps Fans Guessing。

三 |     当前，HBM通过TSV（硅通孔）技术将多层DRAM芯片堆叠于基础裸片之上，最高可支持16层堆叠。HBM与计算模块（XPU，涵盖GPU、TPU等）相互独立，通过2.5D封装共同安装于同一中介层。    

    每个HBM模块配备1024位I/O接口（共16通道），通过物理接口层（PHY）与XPU相连。而下一代HBM4将首次将I/O接口扩展至2048位，这将是自2015年HBM问世以来的最大规格变革。     在封装工艺上，目前主要存在两大技术路径：热压键合配合非导电膜（TC+NCF）和整体回流焊配合模塑底部填充（MR+MUF）。前者在应对芯片翘曲方面更具优势，但热阻较高且生产效率偏低；后者生产效率更高、热阻更低，却更易出现翘曲及间隙填充缺陷。    

    面向未来，SK海力士计划引入混合键合技术，以消除芯片堆叠中的凸块并缩小间距。

四 | 同时，公司正在开发名为“I-HBM”的局部散热技术（类似三星的HPB方案），旨在优化传热路径，更高效地分散热量，为更高层数的堆叠铺路。

五 |     在2.5D封装解决方案方面，SK海力士目前已在传统CoWoS-L、CoWoS-R和CoWoS-S之外，新增了英特尔的EMIB技术，形成更丰富的异构集成选项。     此外，市场传言SK海力士与英特尔有望在存储领域组建合资公司，进一步深化合作。同时，与三星类似，SK海力士也在积极推进3D垂直堆叠方案，将HBM直接置于计算模块之上，以突破现有封装架构的带宽和能效瓶颈。    

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Published on:03:23:20